PREMOLD HOUSING HAVING INTEGRATED VIBRATION ISOLATION

A premold housing for accommodating a chip structure in which a part of the housing that is connected to the chip structure is connected in a manner that permits elastic deflection to another part of the housing which is attached to the supporting structure bearing the entire housing, the two housin...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ABENDROTH MANFRED, INGRISCH KURT, ILICH ERICH
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES TARIFF METERING APPARATUS TESTING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A premold housing for accommodating a chip structure in which a part of the housing that is connected to the chip structure is connected in a manner that permits elastic deflection to another part of the housing which is attached to the supporting structure bearing the entire housing, the two housing parts not contacting one another.