INTER-LAYER CONNECTION FOR FOIL MEMS TECHNOLOGY

The invention relates to a method of manufacturing conductive inter-layer connections in a microsystem built by a patterned stack of flexible foils (10). Conductive inter-layer connections (210, 300, 400) made of solder material, sputtered or evaporated material or by means of carbonization of plast...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BOEREFIJN IVAR J, LANGEREIS GEERT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a method of manufacturing conductive inter-layer connections in a microsystem built by a patterned stack of flexible foils (10). Conductive inter-layer connections (210, 300, 400) made of solder material, sputtered or evaporated material or by means of carbonization of plastic material building the isolating layer (30) of the flexible foils (10) are formed to connect patterned conductive layers (40, 50) separated by means of at least one isolating layer (30) in a conductive way in order to interconnect different parts of the microsystem in an easy way.