BOND HEAD FOR HEAVY WIRE BONDER

BOND HEAD FOR HEAVY WIRE BONDER

A bonding apparatus for bonding a length of wire comprises a first module which is drivable along a linear axis towards and away from a bonding point and a second module slidably mounted to the first module. A wire cutter is mounted to the first module and a bonding tool is mounted to the second mod...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHENG CHI WAH, NG HON KAM BORIS, MAK TIM WAI TONY
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:A bonding apparatus for bonding a length of wire comprises a first module which is drivable along a linear axis towards and away from a bonding point and a second module slidably mounted to the first module. A wire cutter is mounted to the first module and a bonding tool is mounted to the second module. A coupling mechanism is operative to lock the second module in fixed relative position to the first module, and to unlock the second module from its fixed relative position to the first module so that the second module is slidable relative to the first module in directions parallel to the linear axis.