OPTICAL FILM CUTTING METHOD AND OPTICAL FILM

This invention relates to an optical film cutting method which includes cutting an optical film by irradiating the optical film with a laser beam under conditions that an energy per unit length is 0.12 to 0.167 J/mm and that a continuous irradiation time is 0.1 msec or less; as well as to an optical...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AMANO TAKAICHI, NISHIDA KANJI, KITADA KAZUO, HINO ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES USING STIMULATED EMISSION ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	This invention relates to an optical film cutting method which includes cutting an optical film by irradiating the optical film with a laser beam under conditions that an energy per unit length is 0.12 to 0.167 J/mm and that a continuous irradiation time is 0.1 msec or less; as well as to an optical film that is cut by the cutting method and has a size of a raised part generated on a cutting surface thereof of 30 μm or less. According to the optical film cutting method of this invention, it is possible to maintain the raised part size on the optical film cutting surface as small as possible even in the case where the laser beam has characteristics of a gaussian beam, thereby enabling prevention of bonding defect and optical defect when the optical film is incorporated into various optical panels.