Electronic Component Module and Method for the Production Thereof
An electronic component module comprising: at least one multilayer ceramic circuit carrier (2, 3); at least one cooling device comprising at least one heat sink; a composite layer (5, 6) arranged at least in regions between the ceramic circuit carrier (2, 3) and the cooling device (4), said composit...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An electronic component module comprising: at least one multilayer ceramic circuit carrier (2, 3); at least one cooling device comprising at least one heat sink; a composite layer (5, 6) arranged at least in regions between the ceramic circuit carrier (2, 3) and the cooling device (4), said composite layer being formed for reactive connection to the ceramic circuit carrier (2, 3) during a primary process and for connection to the cooling device (4). |
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