NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM

Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.

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Bibliographische Detailangaben
Hauptverfasser: NAIR KUMARAN MANIKNTAN, VOULTOS JOHN D, SKURSKI MICHAEL A
Format: Patent
Sprache:eng
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Zusammenfassung:Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.