METHOD OF ASSEMBLING INTEGRATED CIRCUIT COMPONENTS

The disclosure identified as methods of mounting integrated circuits, including solar cells, to a substrate wherein the circuits are mounted prior to being singulated into discrete die. Once the semiconductor die sites or other circuits are formed on a wafer, the wafer will be attached, either whole...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SPARE BRADLEY, HILLMAN MICHAEL D, TICE GREGORY
Format: Patent
Sprache:eng
Schlagworte:
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