METHOD OF ASSEMBLING INTEGRATED CIRCUIT COMPONENTS

The disclosure identified as methods of mounting integrated circuits, including solar cells, to a substrate wherein the circuits are mounted prior to being singulated into discrete die. Once the semiconductor die sites or other circuits are formed on a wafer, the wafer will be attached, either whole...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SPARE BRADLEY, HILLMAN MICHAEL D, TICE GREGORY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	The disclosure identified as methods of mounting integrated circuits, including solar cells, to a substrate wherein the circuits are mounted prior to being singulated into discrete die. Once the semiconductor die sites or other circuits are formed on a wafer, the wafer will be attached, either whole, or divided into one or more multi-die site wafer segments, to a substrate. This attachment may be by conventional surface mount technology, for example. After such mounting, the individual die sites on the wafer segments will be singulated to form discrete die already mounted to the supporting substrate. The singulation may be preferably performed by laser dicing of the wafer segments.