SEMICONDUCTOR PACKAGE AND METHOD USING ISOLATED VSS PLANE TO ACCOMMADATE HIGH SPEED CIRCUITRY GROUND ISOLATION

SEMICONDUCTOR PACKAGE AND METHOD USING ISOLATED VSS PLANE TO ACCOMMADATE HIGH SPEED CIRCUITRY GROUND ISOLATION

Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate which can have an integrated circuit die attached thereto. The package includes a dedicated high-speed ground plane that is electrically isolated from the ground plane used to ground the low spe...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AMIN AMAR J, CHIA CHOK J, OTHIENO MAURICE O
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate which can have an integrated circuit die attached thereto. The package includes a dedicated high-speed ground plane that is electrically isolated from the ground plane used to ground the low speed circuitry of the package.