HIGH DENSITY INTERCONNECT SYSTEM FOR IC PACKAGES AND INTERCONNECT ASSEMBLIES

An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contactor substrate having a contact surface and a bonding surface, and one or more electrically conductive micro-fabricated spring contacts extending from the probe surface, a second connector structure comprising at least one substrate and having a set of at least one electrically conductive contact pad located on a connector surface and corresponding to the set of spring contacts, and means for movably positioning and aligning the first connector structure and the second connector structure between at least a first position and a second position, such that in at least one position, at least one electrically conductive micro-fabricated spring contact is electrically connected to at least one electrically conductive contact pad.