CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER

The conductive particle of the invention each comprises a conductive nucleus particle and an insulating coating containing an organic high molecular compound on the surface of the nucleus particle, and the coverage factor as defined by the following formula (1) is in the range of 20-40%. Coverage ...

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Bibliographische Detailangaben
Hauptverfasser: TAKETATSU JUN, TANAKA MASARU
Format: Patent
Sprache:eng
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Zusammenfassung:The conductive particle of the invention each comprises a conductive nucleus particle and an insulating coating containing an organic high molecular compound on the surface of the nucleus particle, and the coverage factor as defined by the following formula (1) is in the range of 20-40%. Coverage   factor   ( % ) = ( Area   of   sections   on   nucleus   particle surface   covered   with   insulating   coating ) ( Total   surface   area   of   nucleus   particle ) × 100 ( 1 )