ILLUMINATION ASSEMBLY INCLUDING CHIP-SCALE PACKAGED LIGHT-EMITTING DEVICE

ILLUMINATION ASSEMBLY INCLUDING CHIP-SCALE PACKAGED LIGHT-EMITTING DEVICE

The embodiments described herein are drawn generally towards illumination assemblies including light emitting devices. In some embodiments, the illumination assemblies including chip-scale packaged light-emitting devices and optical elements.

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Bibliographische Detailangaben
Hauptverfasser: PANACCIONE PAUL, ERCHAK ALEXEI A
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The embodiments described herein are drawn generally towards illumination assemblies including light emitting devices. In some embodiments, the illumination assemblies including chip-scale packaged light-emitting devices and optical elements.