INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM

An integrated circuit package stacking system includes: forming a flexible substrate by: providing an insulating material, forming a stacking pad on the insulating material, forming a coupling pad on the insulating material, and forming a trace between the stacking pad and the coupling pad; providin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE SINJAE, PARK JONGVIN, LEE KYUWON, LIM JAEHYUN, OH JIHOON, KIM JINGWAN, CHUN SUNYOUNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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