INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM

INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM

An integrated circuit package stacking system includes: forming a flexible substrate by: providing an insulating material, forming a stacking pad on the insulating material, forming a coupling pad on the insulating material, and forming a trace between the stacking pad and the coupling pad; providin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE SINJAE, PARK JONGVIN, LEE KYUWON, LIM JAEHYUN, OH JIHOON, KIM JINGWAN, CHUN SUNYOUNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package stacking system includes: forming a flexible substrate by: providing an insulating material, forming a stacking pad on the insulating material, forming a coupling pad on the insulating material, and forming a trace between the stacking pad and the coupling pad; providing a package substrate; coupling an integrated circuit to the package substrate; and applying a conductive adhesive on the package substrate for positioning the flexible substrate over the integrated circuit and coupling the flexible substrate on the conductive adhesive.