THERMOPLASTIC MOULDING COMPOSITIONS WITH HIGH STIFFNESS

THERMOPLASTIC MOULDING COMPOSITIONS WITH HIGH STIFFNESS

Thermoplastic molding compositions comprising A) from 40 to 96.2% by weight of a semiaromatic polyamide, B) from 2 to 30% by weight of an impact-modifying polymer which comprises functional groups, C) from 1 to 50% by weight of fibrous or particulate fillers or a mixture of these, D) from 0.2 to 5%...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WEBER MARTIN, SCHNORR JOERG, FUNKHAUSER STEFFEN, HOPFENSPIRGER XAVER, HECKMANN WALTER
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRICITY
INSULATORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:Thermoplastic molding compositions comprising A) from 40 to 96.2% by weight of a semiaromatic polyamide, B) from 2 to 30% by weight of an impact-modifying polymer which comprises functional groups, C) from 1 to 50% by weight of fibrous or particulate fillers or a mixture of these, D) from 0.2 to 5% by weight of a lubricant, E) from 0.5 to 15% by weight of an electrically conductive additive, F) from 0 to 30% by weight of other added materials, where the total of the percentages by weight of components A) to F) is 100%.