Stress Mitigation in Packaged Microchips

A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either verti...

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Bibliographische Detailangaben
Hauptverfasser: FARRELL PETER, PAYDENKAR CHETAN, SPOONER TIMOTHY, KUAN NELSON, ZHANG XIN, JUDY MICHAEL, CHAU KEVIN H.L
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.