INSPECTION SYSTEM AND A METHOD FOR DETECTING DEFECTS BASED UPON A REFERENCE FRAME

A wafer inspection system and a method for inspecting a wafer. The method includes: acquiring multiple frames that cover a first area that comprises a die and a first surrounding area that surrounds the die; wherein the frames partially overlap to provide overlap areas; and processing a sequence of...

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Bibliographische Detailangaben
Hauptverfasser:	POSTOLOV YURI, REGENSBURGER MENA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A wafer inspection system and a method for inspecting a wafer. The method includes: acquiring multiple frames that cover a first area that comprises a die and a first surrounding area that surrounds the die; wherein the frames partially overlap to provide overlap areas; and processing a sequence of decomposed images of overlap areas such as to align mutually misaligned frames and generating a die reference image.