ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONTINUOUS OR NEAR-CONTINUOUS PERIPHERAL CONDUCTING SEAL AND A CONDUCTING LID

ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONTINUOUS OR NEAR-CONTINUOUS PERIPHERAL CONDUCTING SEAL AND A CONDUCTING LID

A semiconductor package structure including a conductive adhesive material which is used to form an electromagnetic interference shield-forming Faraday cage. The Faraday cage incorporates a module lid as the top surface thereof, the conductive material as the sides and a laminate ground plane(s) or...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BEHUN J. RICHARD, COHEN ERWIN B
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package structure including a conductive adhesive material which is used to form an electromagnetic interference shield-forming Faraday cage. The Faraday cage incorporates a module lid as the top surface thereof, the conductive material as the sides and a laminate ground plane(s) or substrate as its bottom. Also disclosed is a method for fabricating the foregoing semiconductor package structure.