PLATING PROCESSING LINE

PLATING PROCESSING LINE

A plating processing line or system includes a plurality of surface processing apparatus including a surface processing apparatus for processing a surface of an object to be treated by introducing a treatment liquid to the surface, and a conveyer unit for conveying the object to be treated, which is...

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Hauptverfasser: SUZUKI MANABU, IMAI MINORU, ISHIBASHI AKIRA, ASOU TOMOHIRO, OGAWA MASAHIRO, KUNIOKA SEIYA, MURAMATSU HITOSHI, SUZUKI NOBUYUKI
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Sprache:eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator SUZUKI MANABU
IMAI MINORU
ISHIBASHI AKIRA
ASOU TOMOHIRO
OGAWA MASAHIRO
KUNIOKA SEIYA
MURAMATSU HITOSHI
SUZUKI NOBUYUKI
description A plating processing line or system includes a plurality of surface processing apparatus including a surface processing apparatus for processing a surface of an object to be treated by introducing a treatment liquid to the surface, and a conveyer unit for conveying the object to be treated, which is disposed between the respective surface processing apparatus linearly or in a curved manner. Each of the surface processing apparatus includes a positioning unit for positioning the object to be treated, which has been conveyed by the conveyer unit to a predetermined position, at which the object is subjected to a pre-plating process or a plating process as a surface processing.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2009277786A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2009277786A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2009277786A13</originalsourceid><addsrcrecordid>eNrjZBAP8HEM8fRzVwgI8nd2DQ4GMX08_Vx5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgYGlkbm5uYWZo6ExcaoAWlEghg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PLATING PROCESSING LINE</title><source>esp@cenet</source><creator>SUZUKI MANABU ; IMAI MINORU ; ISHIBASHI AKIRA ; ASOU TOMOHIRO ; OGAWA MASAHIRO ; KUNIOKA SEIYA ; MURAMATSU HITOSHI ; SUZUKI NOBUYUKI</creator><creatorcontrib>SUZUKI MANABU ; IMAI MINORU ; ISHIBASHI AKIRA ; ASOU TOMOHIRO ; OGAWA MASAHIRO ; KUNIOKA SEIYA ; MURAMATSU HITOSHI ; SUZUKI NOBUYUKI</creatorcontrib><description>A plating processing line or system includes a plurality of surface processing apparatus including a surface processing apparatus for processing a surface of an object to be treated by introducing a treatment liquid to the surface, and a conveyer unit for conveying the object to be treated, which is disposed between the respective surface processing apparatus linearly or in a curved manner. Each of the surface processing apparatus includes a positioning unit for positioning the object to be treated, which has been conveyed by the conveyer unit to a predetermined position, at which the object is subjected to a pre-plating process or a plating process as a surface processing.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20091112&amp;DB=EPODOC&amp;CC=US&amp;NR=2009277786A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20091112&amp;DB=EPODOC&amp;CC=US&amp;NR=2009277786A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUZUKI MANABU</creatorcontrib><creatorcontrib>IMAI MINORU</creatorcontrib><creatorcontrib>ISHIBASHI AKIRA</creatorcontrib><creatorcontrib>ASOU TOMOHIRO</creatorcontrib><creatorcontrib>OGAWA MASAHIRO</creatorcontrib><creatorcontrib>KUNIOKA SEIYA</creatorcontrib><creatorcontrib>MURAMATSU HITOSHI</creatorcontrib><creatorcontrib>SUZUKI NOBUYUKI</creatorcontrib><title>PLATING PROCESSING LINE</title><description>A plating processing line or system includes a plurality of surface processing apparatus including a surface processing apparatus for processing a surface of an object to be treated by introducing a treatment liquid to the surface, and a conveyer unit for conveying the object to be treated, which is disposed between the respective surface processing apparatus linearly or in a curved manner. Each of the surface processing apparatus includes a positioning unit for positioning the object to be treated, which has been conveyed by the conveyer unit to a predetermined position, at which the object is subjected to a pre-plating process or a plating process as a surface processing.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAP8HEM8fRzVwgI8nd2DQ4GMX08_Vx5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgYGlkbm5uYWZo6ExcaoAWlEghg</recordid><startdate>20091112</startdate><enddate>20091112</enddate><creator>SUZUKI MANABU</creator><creator>IMAI MINORU</creator><creator>ISHIBASHI AKIRA</creator><creator>ASOU TOMOHIRO</creator><creator>OGAWA MASAHIRO</creator><creator>KUNIOKA SEIYA</creator><creator>MURAMATSU HITOSHI</creator><creator>SUZUKI NOBUYUKI</creator><scope>EVB</scope></search><sort><creationdate>20091112</creationdate><title>PLATING PROCESSING LINE</title><author>SUZUKI MANABU ; IMAI MINORU ; ISHIBASHI AKIRA ; ASOU TOMOHIRO ; OGAWA MASAHIRO ; KUNIOKA SEIYA ; MURAMATSU HITOSHI ; SUZUKI NOBUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2009277786A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>SUZUKI MANABU</creatorcontrib><creatorcontrib>IMAI MINORU</creatorcontrib><creatorcontrib>ISHIBASHI AKIRA</creatorcontrib><creatorcontrib>ASOU TOMOHIRO</creatorcontrib><creatorcontrib>OGAWA MASAHIRO</creatorcontrib><creatorcontrib>KUNIOKA SEIYA</creatorcontrib><creatorcontrib>MURAMATSU HITOSHI</creatorcontrib><creatorcontrib>SUZUKI NOBUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUZUKI MANABU</au><au>IMAI MINORU</au><au>ISHIBASHI AKIRA</au><au>ASOU TOMOHIRO</au><au>OGAWA MASAHIRO</au><au>KUNIOKA SEIYA</au><au>MURAMATSU HITOSHI</au><au>SUZUKI NOBUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PLATING PROCESSING LINE</title><date>2009-11-12</date><risdate>2009</risdate><abstract>A plating processing line or system includes a plurality of surface processing apparatus including a surface processing apparatus for processing a surface of an object to be treated by introducing a treatment liquid to the surface, and a conveyer unit for conveying the object to be treated, which is disposed between the respective surface processing apparatus linearly or in a curved manner. Each of the surface processing apparatus includes a positioning unit for positioning the object to be treated, which has been conveyed by the conveyer unit to a predetermined position, at which the object is subjected to a pre-plating process or a plating process as a surface processing.</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title PLATING PROCESSING LINE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T09%3A23%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUZUKI%20MANABU&rft.date=2009-11-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2009277786A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true