PLATING PROCESSING LINE

A plating processing line or system includes a plurality of surface processing apparatus including a surface processing apparatus for processing a surface of an object to be treated by introducing a treatment liquid to the surface, and a conveyer unit for conveying the object to be treated, which is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI MANABU, IMAI MINORU, ISHIBASHI AKIRA, ASOU TOMOHIRO, OGAWA MASAHIRO, KUNIOKA SEIYA, MURAMATSU HITOSHI, SUZUKI NOBUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	A plating processing line or system includes a plurality of surface processing apparatus including a surface processing apparatus for processing a surface of an object to be treated by introducing a treatment liquid to the surface, and a conveyer unit for conveying the object to be treated, which is disposed between the respective surface processing apparatus linearly or in a curved manner. Each of the surface processing apparatus includes a positioning unit for positioning the object to be treated, which has been conveyed by the conveyer unit to a predetermined position, at which the object is subjected to a pre-plating process or a plating process as a surface processing.