IMAGE SENSOR PACKAGE AND CAMERA MODULE HAVING SAME

IMAGE SENSOR PACKAGE AND CAMERA MODULE HAVING SAME

An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and elect...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE CHI-KUEI, WU YINGNG
Format: Patent
Sprache:eng
Schlagworte:
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
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Beschreibung
Zusammenfassung:An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and electrically connected to the first substrate. The image sensor chip package further includes a second substrate. The processing chip and the passive elements are mounted on the second substrate and electrically connected to the second substrate. The bottom surface of the first substrate defines a cavity for receiving the second substrate, the processing chip and the passive elements therein.