Methods and Apparatus for Heat Transfer for a Component

Methods and apparatus for transferring heat according to various aspects of the present invention operate in conjunction with a heat source on a substrate. In one embodiment, a lid is adapted to engage the substrate. The lid may comprise a thermally conductive rigid body and one or more hardstops co...

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Bibliographische Detailangaben
Hauptverfasser:	ROCHE-RIOS ISIS, CUNNINGTON GEORGE R, KONEN CYNTHIA R, PAULSON KEVIN A, MYERS JAMES R, PETERSON STEVEN N, FAORO JAMES E
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Methods and apparatus for transferring heat according to various aspects of the present invention operate in conjunction with a heat source on a substrate. In one embodiment, a lid is adapted to engage the substrate. The lid may comprise a thermally conductive rigid body and one or more hardstops configured to limit a bond line distance between the rigid body and the heat source. A thermal interface material may be disposed in the bond line between the heat source and the lid. The thermal interface material may be adapted to provide a thermally conductive adhesive bond between the lid and the heat source.