PACKAGING STRUCTURE OF ORGANIC LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

The present invention discloses a packaging structure of organic light-emitting diode and a method for manufacturing the same. According to the present invention, an organic light emitter layer, which comprises an anode layer, an organic light-emitting layer, and a cathode layer, is provided. A firs...

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Bibliographische Detailangaben
Hauptverfasser:	LIAO YUNG-SHIL, LIU KOUN, TSENG CHIEN-JUNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention discloses a packaging structure of organic light-emitting diode and a method for manufacturing the same. According to the present invention, an organic light emitter layer, which comprises an anode layer, an organic light-emitting layer, and a cathode layer, is provided. A first transparent passivation layer is set on the cathode layer, and has light transmittance greater than 80%. In addition, the first transparent passivation layer has an amorphous or crystalline structure for isolating oxygen and vapor. Because the first transparent passivation layer is sputtered in vacuum at room temperature, it can be applied to flexible printed circuit boards. Furthermore, a second transparent passivation layer is set under a substrate, which is under the organic light emitter layer. Alternatively, a resin layer is set on the first transparent passivation layer or under the second transparent passivation layer as the multi-layer packaging structure.