METHOD TO IMPROVE WRITER LEAKAGE IN SiGe BIPOLAR DEVICE

The invention, in one aspect, provides a method for fabricating a semiconductor device, which includes conducting an etch through an opening in an emitter layer to form a cavity from an underlying oxide layer that exposes a doped tub. A first silicon/germanium (SiGe) layer, which has a Ge concentrat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ROSSI NACE M, DYSON MARK, SINGH RANBIR, CHEN ALAN S
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention, in one aspect, provides a method for fabricating a semiconductor device, which includes conducting an etch through an opening in an emitter layer to form a cavity from an underlying oxide layer that exposes a doped tub. A first silicon/germanium (SiGe) layer, which has a Ge concentration therein, is formed within the cavity and over the doped tub by adjusting a process parameter to induce a strain in the first SiGe layer. A second SiGe layer is formed over the first SiGe layer, and a capping layer is formed over the second SiGe layer.