Method for Producing Optoelectronic Components, and Products Produced Thereby

The invention relates to the production of optoelectronic components, optical components being mounted in the composite wafer. Provided to this end is a method for producing optoelectronic components, in particular image signal acquiring or image signal outputting components, in the case of which op...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WOELFING BERND, AUCHTER-KRUMMEL PETRA, PAWLOWSKI EDGAR, BIERTUEMPFEL RALF, BRAUNECK ULF, HAYDEN JOSEPH S, FOTHERINGHAM ULRICH, FLEISSNER FRANK
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention relates to the production of optoelectronic components, optical components being mounted in the composite wafer. Provided to this end is a method for producing optoelectronic components, in particular image signal acquiring or image signal outputting components, in the case of which optical components are respectively provided, picked up and mounted on a wafer, the optical components preferably respectively being positioned individually or in groups relative to the position of assigned optoelectronic or optical components of the wafer or of a wafer to be connected thereto.