ELECTRONIC DEVICE CARRIER TAPE

One aspect provides a carrier tape configured to transport semiconductor packages having a semiconductor package thickness. The carrier tape includes a film having a film thickness extending between a first major surface and a second major surface that is less than the semiconductor package thicknes...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	BAKAR ROSLIE SAINI BIN
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING UNPACKING
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Beschreibung
Zusammenfassung:	One aspect provides a carrier tape configured to transport semiconductor packages having a semiconductor package thickness. The carrier tape includes a film having a film thickness extending between a first major surface and a second major surface that is less than the semiconductor package thickness. The film is structured to define at least a first structure and a second structure extending between the first and second major surfaces, the first and second structure(s) each having a structure height that is at least equal to the semiconductor package thickness. A hole is punched entirely through the film thickness to define a pocket positioned between the first and second structures, the pocket having a depth equal to the structure height.