Method for sealing an electronic device

A method for sealing an electronic device, such as an OLED display device or a photovoltaic device. An assembly comprising first and second substantially planar substrates with an electronic component disposed therebetween and encircled by a sealing material such as a glass frit is placed on a support plate. A pressure plate is positioned over the assembly. Electromagnets disposed in the support plate are activated by flowing a current through the electromagnets, and the magnetic force developed by the electromagnets draws the pressure plate toward the support plate, thereby applying a force against the assembly. The sealing material (e.g. glass frit) may be irradiated by an irradiation source, such as a laser, thereby forming a hermetic seal between the first and second substrates.