COMPRESSION MOLDING METHOD FOR ELECTRONIC COMPONENT AND COMPRESSION MOLDING APPARATUS EMPLOYED THEREFOR

First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold s...

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Bibliographische Detailangaben
Hauptverfasser:	GOTOH TOMOYUKI, YAMADA TETSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.