PANEL LEVEL METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH INTEGRATED HEAT SINKS

PANEL LEVEL METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH INTEGRATED HEAT SINKS

Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages each having an exposed heat sink on one outer surface of the package and an exposed die attach pad on a second opposi...

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Bibliographische Detailangaben
Hauptverfasser: YEONG SHEE MIN, WONG EUGENE KAI POH, CHONG SEK HOI, KOH DANNY CHER HAU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages each having an exposed heat sink on one outer surface of the package and an exposed die attach pad on a second opposite surface of the package.