Reactive Multilayer Joining With Improved Metallization Techniques

A process and apparatus for the reactive multilayer joining of components utilizing a print screen metallization technique to bond difficult-to-wet materials and temperature sensitive materials to produce joined products.

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Bibliographische Detailangaben
Hauptverfasser:	SPRAKER RONALD L, WEIHS TIMOTHY P, CASWELL GREG
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A process and apparatus for the reactive multilayer joining of components utilizing a print screen metallization technique to bond difficult-to-wet materials and temperature sensitive materials to produce joined products.