ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME, AND WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME, AND WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

An electronic apparatus includes a multilayer wiring structure having insulating layers and wiring layers which are stacked and having a surface on which an electronic component is mounted, a dipole antenna formed on a surface 13A of the multilayer wiring structure, a radiating plate disposed on the...

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Bibliographische Detailangaben
Hauptverfasser: FUJI TOMOHARU, TAKEUCHI YUKIHARU
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:An electronic apparatus includes a multilayer wiring structure having insulating layers and wiring layers which are stacked and having a surface on which an electronic component is mounted, a dipole antenna formed on a surface 13A of the multilayer wiring structure, a radiating plate disposed on the surface together with the dipole antenna, and a radiating path formed in the multilayer wiring structure and serving to transfer a heat generated in the electronic component to the radiating plate.