Method of Producing Oxide Particles, Slurry, Polishing Slurry, and Mehod of Polishing Substrate
The present invention provides a method of producing oxide particles, comprising a step of mixing a metal carbonate with an acid to give a mixture, a step of heating the mixture to give a metal oxide and a step of pulverizing the metal oxide, and slurry wherein metal oxide particles obtained by the...
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| creator | SAKURADA TAKAFUMI HOSAKA DAISUKE CHINONE KANSHI |
| description | The present invention provides a method of producing oxide particles, comprising a step of mixing a metal carbonate with an acid to give a mixture, a step of heating the mixture to give a metal oxide and a step of pulverizing the metal oxide, and slurry wherein metal oxide particles obtained by the above method of producing are dispersed in an aqueous medium, a polishing slurry, and a method of polishing a substrate. Particularly, the present invention provides a polishing slurry containing cerium oxide particles obtained by using cerium carbonate as the metal carbonate material and oxalic acid as the acid. The present invention provides a method of producing oxide particles, wherein coarse particle- and abrasion powder-free fine particles can be rapidly obtained. The present invention also provides a polishing slurry using the oxide particles, which can maintain a suitable polishing rate, can reduce generation of scratches, and can accurately polish the surface of a semiconductor. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2009165396A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2009165396A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2009165396A13</originalsourceid><addsrcrecordid>eNrjZIj3TS3JyE9RyE9TCCjKTylNzsxLV_CvyExJVQhILCrJTM5JLdZRCM4pLSqq1FEIyM_JLM4AKYGJJOalKPimwkxASJcmFZcUJZak8jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMDS0MzU2NLM0dDY-JUAQDl4jz_</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of Producing Oxide Particles, Slurry, Polishing Slurry, and Mehod of Polishing Substrate</title><source>esp@cenet</source><creator>SAKURADA TAKAFUMI ; HOSAKA DAISUKE ; CHINONE KANSHI</creator><creatorcontrib>SAKURADA TAKAFUMI ; HOSAKA DAISUKE ; CHINONE KANSHI</creatorcontrib><description>The present invention provides a method of producing oxide particles, comprising a step of mixing a metal carbonate with an acid to give a mixture, a step of heating the mixture to give a metal oxide and a step of pulverizing the metal oxide, and slurry wherein metal oxide particles obtained by the above method of producing are dispersed in an aqueous medium, a polishing slurry, and a method of polishing a substrate. Particularly, the present invention provides a polishing slurry containing cerium oxide particles obtained by using cerium carbonate as the metal carbonate material and oxalic acid as the acid. The present invention provides a method of producing oxide particles, wherein coarse particle- and abrasion powder-free fine particles can be rapidly obtained. The present invention also provides a polishing slurry using the oxide particles, which can maintain a suitable polishing rate, can reduce generation of scratches, and can accurately polish the surface of a semiconductor.</description><language>eng</language><subject>ADHESIVES ; CHEMISTRY ; COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS ; DYES ; INORGANIC CHEMISTRY ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; POLISHES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090702&DB=EPODOC&CC=US&NR=2009165396A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090702&DB=EPODOC&CC=US&NR=2009165396A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKURADA TAKAFUMI</creatorcontrib><creatorcontrib>HOSAKA DAISUKE</creatorcontrib><creatorcontrib>CHINONE KANSHI</creatorcontrib><title>Method of Producing Oxide Particles, Slurry, Polishing Slurry, and Mehod of Polishing Substrate</title><description>The present invention provides a method of producing oxide particles, comprising a step of mixing a metal carbonate with an acid to give a mixture, a step of heating the mixture to give a metal oxide and a step of pulverizing the metal oxide, and slurry wherein metal oxide particles obtained by the above method of producing are dispersed in an aqueous medium, a polishing slurry, and a method of polishing a substrate. Particularly, the present invention provides a polishing slurry containing cerium oxide particles obtained by using cerium carbonate as the metal carbonate material and oxalic acid as the acid. The present invention provides a method of producing oxide particles, wherein coarse particle- and abrasion powder-free fine particles can be rapidly obtained. The present invention also provides a polishing slurry using the oxide particles, which can maintain a suitable polishing rate, can reduce generation of scratches, and can accurately polish the surface of a semiconductor.</description><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS</subject><subject>DYES</subject><subject>INORGANIC CHEMISTRY</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>POLISHES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIj3TS3JyE9RyE9TCCjKTylNzsxLV_CvyExJVQhILCrJTM5JLdZRCM4pLSqq1FEIyM_JLM4AKYGJJOalKPimwkxASJcmFZcUJZak8jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMDS0MzU2NLM0dDY-JUAQDl4jz_</recordid><startdate>20090702</startdate><enddate>20090702</enddate><creator>SAKURADA TAKAFUMI</creator><creator>HOSAKA DAISUKE</creator><creator>CHINONE KANSHI</creator><scope>EVB</scope></search><sort><creationdate>20090702</creationdate><title>Method of Producing Oxide Particles, Slurry, Polishing Slurry, and Mehod of Polishing Substrate</title><author>SAKURADA TAKAFUMI ; HOSAKA DAISUKE ; CHINONE KANSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2009165396A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS</topic><topic>DYES</topic><topic>INORGANIC CHEMISTRY</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>POLISHES</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKURADA TAKAFUMI</creatorcontrib><creatorcontrib>HOSAKA DAISUKE</creatorcontrib><creatorcontrib>CHINONE KANSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKURADA TAKAFUMI</au><au>HOSAKA DAISUKE</au><au>CHINONE KANSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of Producing Oxide Particles, Slurry, Polishing Slurry, and Mehod of Polishing Substrate</title><date>2009-07-02</date><risdate>2009</risdate><abstract>The present invention provides a method of producing oxide particles, comprising a step of mixing a metal carbonate with an acid to give a mixture, a step of heating the mixture to give a metal oxide and a step of pulverizing the metal oxide, and slurry wherein metal oxide particles obtained by the above method of producing are dispersed in an aqueous medium, a polishing slurry, and a method of polishing a substrate. Particularly, the present invention provides a polishing slurry containing cerium oxide particles obtained by using cerium carbonate as the metal carbonate material and oxalic acid as the acid. The present invention provides a method of producing oxide particles, wherein coarse particle- and abrasion powder-free fine particles can be rapidly obtained. The present invention also provides a polishing slurry using the oxide particles, which can maintain a suitable polishing rate, can reduce generation of scratches, and can accurately polish the surface of a semiconductor.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES CHEMISTRY COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS DYES INORGANIC CHEMISTRY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES |
| title | Method of Producing Oxide Particles, Slurry, Polishing Slurry, and Mehod of Polishing Substrate |
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