Method of Producing Oxide Particles, Slurry, Polishing Slurry, and Mehod of Polishing Substrate

The present invention provides a method of producing oxide particles, comprising a step of mixing a metal carbonate with an acid to give a mixture, a step of heating the mixture to give a metal oxide and a step of pulverizing the metal oxide, and slurry wherein metal oxide particles obtained by the above method of producing are dispersed in an aqueous medium, a polishing slurry, and a method of polishing a substrate. Particularly, the present invention provides a polishing slurry containing cerium oxide particles obtained by using cerium carbonate as the metal carbonate material and oxalic acid as the acid. The present invention provides a method of producing oxide particles, wherein coarse particle- and abrasion powder-free fine particles can be rapidly obtained. The present invention also provides a polishing slurry using the oxide particles, which can maintain a suitable polishing rate, can reduce generation of scratches, and can accurately polish the surface of a semiconductor.