INTEGRATED CIRCUIT PACKAGE

An integrated circuit package is described that includes two dice. The active surface of each die includes a plurality of I/O pads. The active surface of the first die is positioned adjacent first surfaces of the leads of a leadframe such that I/O pads from the first die are arranged adjacent corresponding solder pad surfaces on the first surfaces. Similarly, the active surface of the second die is positioned adjacent second surfaces of the leads opposite the first surfaces such that I/O pads from the second die are arranged adjacent corresponding solder pad surfaces on the second surfaces. A plurality of solder joints are arranged to physically and electrically connect I/O pads from the first or second die to associated adjacent solder pad surfaces on the leads. In this way, a single leadframe can be utilized to package two dice, one on either side of the leads of the leadframe.