MEMORY MODULE HEAT SINK

MEMORY MODULE HEAT SINK

The invention relates to a memory module heat sink, in particular for FB-DIMM memory modules, for dissipating heat generated in the memory module to the outside, having an essentially planar metal plate (100, 150) to which the memory module can be fixed, wherein the metal plate (100, 150) has on its...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEGEN ANTON, WOOD STEVE
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:The invention relates to a memory module heat sink, in particular for FB-DIMM memory modules, for dissipating heat generated in the memory module to the outside, having an essentially planar metal plate (100, 150) to which the memory module can be fixed, wherein the metal plate (100, 150) has on its outer edge a stiffening element (110, 160) that runs at least partially along the outer edge.