Integrated Circuit Device Including A Contactless Integrated Circuit Inlay

Embodiments provide an integrated circuit device including a contactless integrated circuit inlay. The device includes a substrate, an integrated circuit coupled to the substrate, and a coil electrically coupled to the integrated circuit and coupled to the substrate. The coil includes a first conduc...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	RAGGAM PETER, GRIESHOFER THOMAS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HANDLING RECORD CARRIERS INDUCTANCES MAGNETS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSFORMERS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Embodiments provide an integrated circuit device including a contactless integrated circuit inlay. The device includes a substrate, an integrated circuit coupled to the substrate, and a coil electrically coupled to the integrated circuit and coupled to the substrate. The coil includes a first conductive line disposed in multiple turns on the substrate and a second conductive line disposed in multiple turns on the substrate.