METHOD OF FORMING A DUAL-DAMASCENE STRUCTURE USING AN UNDERLAYER

A method of forming a dual-damascene wire. The method includes forming a via opening in a dielectric layer, filling the via opening with a polymeric formation including at least about 6% by weight of solids of thermal acid generator; heating the polymeric underlayer to a temperature greater than roo...

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Bibliographische Detailangaben

Hauptverfasser:	COLBURN MATTHEW EARL, MEDEIROS DAVID R, BURNS SEAN DAVID, PATEL KAUSHAL, VYKLICKY LIBOR, LUSTIG NAFTALI ELIAHU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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