SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

A semiconductor component and a method of manufacturing is disclosed. One embodiment provides a semiconductor chip with a chip pad and a support pad and a substrate with a substrate pad. The support pad is connected by wire bonding to the chip pad and the support pad.

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Hauptverfasser: HINZ CHRISTINE, YOON KIMYUNG, BERNHARDT DIRK
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HINZ CHRISTINE
YOON KIMYUNG
BERNHARDT DIRK
description A semiconductor component and a method of manufacturing is disclosed. One embodiment provides a semiconductor chip with a chip pad and a support pad and a substrate with a substrate pad. The support pad is connected by wire bonding to the chip pad and the support pad.
format Patent
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING
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