SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

A semiconductor component and a method of manufacturing is disclosed. One embodiment provides a semiconductor chip with a chip pad and a support pad and a substrate with a substrate pad. The support pad is connected by wire bonding to the chip pad and the support pad.

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Bibliographische Detailangaben
Hauptverfasser:	HINZ CHRISTINE, YOON KIMYUNG, BERNHARDT DIRK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor component and a method of manufacturing is disclosed. One embodiment provides a semiconductor chip with a chip pad and a support pad and a substrate with a substrate pad. The support pad is connected by wire bonding to the chip pad and the support pad.