Surface inspection device

A surface inspection device includes an illumination optical system that illuminates, with a linearly polarized light, a surface of a wafer where a repeated pattern is formed; an alignment stage that holds the wafer; a pick-up optical system that picks up an image of reflected light from the surface...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUJIMORI YOSHIHIKO, ISHII YUWA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A surface inspection device includes an illumination optical system that illuminates, with a linearly polarized light, a surface of a wafer where a repeated pattern is formed; an alignment stage that holds the wafer; a pick-up optical system that picks up an image of reflected light from the surface of the wafer; an image storage unit that stores the image picked up by the pick-up optical system; an image processing unit that performs predetermined image processing on the image stored in the image storage unit and detects a defect of the repeated pattern; and an image output unit that outputs the results of the image processing by the image processing unit. The orientation of the transmission axis of a second polarizing plate is set to be inclined at 45 degrees with respect to the transmission axis of a first polarizing plate.