Fluid cooled semiconductor power module having double-sided cooling

A semiconductor power module includes one or more power semiconductor power devices sandwiched between a fluid conducting base and a fluid conducting cover joined to the base. Fluid coolant entering the base diverges into a first flow path through the base and a second parallel flow path through the cover, and then converges and discharges through an outlet. The semiconductor devices have upper and lower active areas that are thermally coupled to inboard faces of the cover and base for low double-sided thermal resistance, and the devices are electrically accessed through a set of terminals formed on the base. Multiple sets of semiconductor power devices are double-side cooled by joining multiple fluid conducting covers to the base such that the coolant successively diverges and then re-converges at the locations where each cover is joined to the base. Preferably, the flow paths in both the base and cover include integral features for enhancing the surface area in contact with the coolant.