TIN POWDER, MANUFACTURING METHOD OF TIN POWDER AND CONDUCTIVE PASTE CONTAINING TIN POWDER

Object of the invention is to provide a tin powder containing fine tin particles which performs fine pitch wiring circuit easily, excellent in filling the minute diameter via holes, and exhibits low temperature fusibility. In order to achieve the object, a copper powder slurry is prepared by adding...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YOSHIMARU KATSUHIKO, FURUMOTO KEITA, SAKAUE TAKAHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASTING CLADDING OR PLATING BY SOLDERING OR WELDING CONDUCTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRICITY INSULATORS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Object of the invention is to provide a tin powder containing fine tin particles which performs fine pitch wiring circuit easily, excellent in filling the minute diameter via holes, and exhibits low temperature fusibility. In order to achieve the object, a copper powder slurry is prepared by adding a copper powder in water with agitation and a tin solution for deposition by substitution is prepared by adding an acid to an aqueous mixture solution containing a stannous salt and thiourea. Then the copper powder slurry and the tin solution for deposition by substitution are mixed with agitation in a certain ratio of tin in the solution against to copper in the slurry to deposit tin by substitution on the surface of the copper powder. As a result, the tin powder of the present invention is obtained.