Methods of Packaging Valve Chips and Related Valve Assemblies

A valve chip may include a substrate having first and second faces and openings between the first and second faces, and a plurality of flexible valve flaps on one of the faces of the substrate with each flexible valve flap being associated with at least one of the openings. The valve chip may be pac...

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Bibliographische Detailangaben
Hauptverfasser:	DOUGLAS KEVIN R, GIBSON PAUL W, LASKI JAMES C, TEACH WILLIAM O, HARRIS DONALD C
Format:	Patent
Sprache:	eng
Schlagworte:	ACTUATING-FLOATS BLASTING COCKS CONTROLLING DEVICES FOR VENTING OR AERATING ENGINEERING ELEMENTS AND UNITS FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING ORCONTROL PURPOSES FLUID-PRESSURE ACTUATORS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEATING HYDRAULICS OR PNEUMATICS IN GENERAL LIGHTING MECHANICAL ENGINEERING PHYSICS REGULATING SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES TAPS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THERMAL INSULATION IN GENERAL VALVES WEAPONS
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Beschreibung
Zusammenfassung:	A valve chip may include a substrate having first and second faces and openings between the first and second faces, and a plurality of flexible valve flaps on one of the faces of the substrate with each flexible valve flap being associated with at least one of the openings. The valve chip may be packaged by forming a frame having an opening therein, and securing the valve chip in the opening of the frame. More particularly, the valve chip may be secured in the opening so that central portions of the first and second faces of the substrate are exposed through the opening in the frame and so that a fluid seal is provided between the frame and edges of the substrate. Related valves, valve assemblies, and methods are also discussed.