Substrate Processing Method and Substrate Processing Apparatus
A substrate processing method that achieves enhancement in productivity by making it possible to confirm the end point in the ashing process precisely is provided. The substrate processing method includes: detecting emission intensity; calculating an amount of variance in emission intensity that has...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A substrate processing method that achieves enhancement in productivity by making it possible to confirm the end point in the ashing process precisely is provided. The substrate processing method includes: detecting emission intensity; calculating an amount of variance in emission intensity that has been detected; detecting an end point from the calculated amount of variance in emission intensity; making a comparison between the detected end point and a predetermined time; and displaying a result of the comparison. |
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