Solderable EMI Gasket and Grounding Pad

Apparatus, which is useful as both a conductive gasket and a grounding pad, which has a compressible elastomeric substrate having at least one side surface and two ends, a conductive elastomeric layer adjacent to all of the side surfaces of the compressible substrate, and a metal layer adjacent to t...

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Bibliographische Detailangaben
Hauptverfasser:	ZONVIDE KOSSI, TRETHEWEY JEREMY
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING CYLINDERS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PISTONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEALINGS SOLDERING OR UNSOLDERING SPRAYING OR ATOMISING IN GENERAL THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Apparatus, which is useful as both a conductive gasket and a grounding pad, which has a compressible elastomeric substrate having at least one side surface and two ends, a conductive elastomeric layer adjacent to all of the side surfaces of the compressible substrate, and a metal layer adjacent to the conductive layer.