Method for fabricating semiconductor device installed with passive components

A method for fabricating a semiconductor device installed with passive components is provided. The method includes: having at least a passive component make a bridge connection between a ground circuit and a power circuit of each of a plurality of substrate units; electrically connecting a conductiv...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG CHUNG-PAO, CHEN CHIENIH, SUNG CHIENIH, KU YUNGUAN, LIN MING-SHAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!