Method of Fabricating a Structure for a Semiconductor Device
There is described a method of fabricating a dual damascene structure for a semiconductor device. A halogen based pre-cursor is used during vapour deposition of a diffusion barrier layer in a trench or via formed in a substrate. Residual halogen from the deposition is allowed to remain on the barrie...
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Sprache: | eng |
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Zusammenfassung: | There is described a method of fabricating a dual damascene structure for a semiconductor device. A halogen based pre-cursor is used during vapour deposition of a diffusion barrier layer in a trench or via formed in a substrate. Residual halogen from the deposition is allowed to remain on the barrier layer and is used to catalyse growth of a metal layer on the barrier layer to fill the trench or via. |
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