Monolithic diode-pumped laser cavity

A monolithic pumped laser cavity design is disclosed. Elements of the laser cavity, such as gain material, Q-switch, reflector, and outcoupler, are contact bonded together with a thermally conductive epoxy. The assembly is then operatively coupled to a heat sink (e.g., by mechanical or chemical means). The assembly is potted in thermally conductive potting material. The stacked elements or a subset thereof may be bonded to heat sink mounts and/or face cooling layers. In this fashion, various elements can be easily assembled and bonded together to provide the desired combination of laser energy, pulse width, and repetition frequency. The thermally conductive potting material provides structural integrity, as well as thermal management by extracting heat from the encased assembly to the heat sink. The optional heat sink mounts and face cooling operate to further extract heat and reduce thermal loading. Outcoupling to fiber may also be provided.