Integrated Circuits; Methods for Manufacturing an Integrated Circuit; Memory Modules; Computing Systems

Embodiments of the present invention relate generally to integrated circuits, methods for manufacturing an integrated circuit, memory modules, and computing systems.

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Bibliographische Detailangaben
Hauptverfasser: KOEBERNIK GERT, MANGER DIRK, SPECHT MICHAEL, GUTSCHE JAN, WILLER JOSEPH, SCHULZ DORIS KEITEL, FRIEDERICH CHRISTOPH, RUTTKOWSKI EIKE, RICHTER DETLEV, KNOBLOCH KLAUS, MEYER STEFFEN, MOELLER HOLGER, OISIN KENNY
Format: Patent
Sprache:eng
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Zusammenfassung:Embodiments of the present invention relate generally to integrated circuits, methods for manufacturing an integrated circuit, memory modules, and computing systems.