ELECTRONIC ASSEMBLY WITH EMI SHIELDING HEAT SINK

An example electronic assembly includes a substrate that has a first surface and a second surface. The first surface of the substrate includes a grounding ring. The electronic assembly further includes one or more electronic components that are mounted on the first surface of the substrate such that the grounding ring at least partially surrounds the electronic components(s). A heat sink engages the electronic component(s) and the grounding ring in order provide cooling and EMI shielding to the electronic components(s). In some embodiments, the grounding ring surrounds the entire electronic components(s) and the heat sink engages the entire grounding ring, although in other embodiments, the grounding ring may partially surround the electronic components(s) and/or the heat sink may engage just a portion of the grounding ring.